Universal Monitoring Burn-in Tester for DRAM and Flash Memory Packages.
By controlling each temperature zone at different condition, customer is able to maximize system utilization at reliability verification test.
The system has capability to test all functional items.
Target Protocols: SRAM, DRAM(DDR, LPDDR, GDDR) Flash Memory(NOR, NAND, EMMC, etc), MCP
Target Form Factors: All Type BGA Burn-in Socket
Temperature Range: -40℃ ~ 125℃(Optional Humidity Chamber)